Technology
FCF MARKETING∶
E-MAIL∶ david@fcfpcb.com.hk
Sales@fcfpcb.com.hk
SKYPE∶ fcfpcb
TEL∶ +852-6876 3343
MOB∶+86-135000 41048
| |
PCB |
The current position is∶Home＞PCB |
| ITEM |
Parameter |
| Layer count |
1-24 layers |
| Material |
FR-4, Tg=135, 150, 170,180, 210 |
|
CEM-3, CEM-1 |
|
Teflon, Al base |
|
Rogers, Nelco |
| Copper thickness |
1/2oz(18um),1oz(35um),2oz(70um), 3oz(105um), 4oz(140um), 5oz(175um) |
| Board thickness |
8-236mil (0.2--6.0mm) |
| Max. panel size |
32"x20" (800x508mm) |
| Min. line width/space |
3/3mil (75/75um) |
| Min. innerlayer annular ring |
4mil (0.10mm) |
| Min. core thickness |
4mil (0.10mm) |
| Surface treating of innerlayer |
Brown oxide |
| Innerlayer ragistration |
3mil (76um) |
| Tolerance of board thickness |
12-10% |
| Min. Drill Size |
8mil (0.2mm) |
| Min. HDI laser drill size |
3mil (0.10mm) |
| Tolerance of hole size |
2mil (0.05mm) |
| Tolerance of hole position |
2mil (0.05mm) |
| Max.Aspect ratio |
10:01 |
| PTH copper thickness |
1mil (25um) |
| Solder mask color |
Green,blue,yellow,white, black |
| Solder mask thickness |
5-30um |
| Solder mask hardness |
6H |
| Min. solder mask dam |
3mil (75um) |
| Max.hole size of S/M plug |
24mil (0.6mm) |
| Peel able Solder mask |
YES |
| Carbon ink |
YES |
| Surface treating |
HASL (ROHS) |
|
ENING(Immersion gold) |
|
OSP |
|
Immersion silver |
|
Immersion tin |
|
Flash gold |
|
Gold finger |
| Nickel thickness |
120-240u" (3-6um) |
| Gold thickness |
2-30u" (0.05-0.76um) |
| Impedance control |
Ohms +/-10% |
| Blind hole/ Buried hole |
YES |
| Half hole |
YES |
| Sink hole |
YES |
| HDI |
1+1+N+1+1 |
| VOP (via on pad) |
YES |
| Rouuting Tolerance |
6mil (0.15mm) |
| V-CUT |
YES |
| Solderability test |
245C, 5S |
| Thermal stress test |
280/10 secs |
| Peel strength of line |
61B/in (107g/mm) |
| Warp and twist |
0.75% |
|
