Capability

1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA/CSP/IC
4.SMT with 6 million placements per day
5.Manual insertion with output 400,000pcs components per day
6.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit

Equipment

SMT1.DEK 265GSX+MSHG1+MV2F+MPA-G1+HELLER 1800W
SMT2.DEK ELA+MSH2+MV2F+MPA-3+KELONG REFLOWER
SMT3.SPP-G1+MSH2+MV2F+MPA3+FLEXTRONICSREFLOWER
SMT4.SPPD+TCM3500Z+HELLEER 1800EXL
AI : 2 Set
Handwork line : 2 Line
Other : TEST, PACKING Machine