Technology
FCF MARKETING∶
E-MAIL∶ david@fcfpcb.com.hk
Sales@fcfpcb.com.hk
SKYPE∶ fcfpcb
TEL∶ +852-6876 3343
MOB∶+86-135000 41048
| |
HDI |
The current position is∶Home＞HDI |
| Technology Roadmap for HDI PCB |
| Item |
|
Parameter |
|
|
| Min Line Width/Spacing |
|
3 / 3mil |
Inner Layer |
|
| |
3 / 3mil |
Outer Layer |
|
| Laser Direct Image |
|
Yes |
|
|
| Copper Filling Dimple Size |
|
15um |
|
|
| Laser Dielectric Thickness |
|
1.5 - 3.5mil |
Min - Max |
|
| Min Laser Drill Diameter/Drill pad size |
|
3 / 8.9mil |
|
|
|
| Max Laser Via Aspect Ratio |
|
0.8:1 |
|
|
| BGA Pitch |
|
0.35mm |
|
|
|
| Soldermask Registration |
|
+/- 37.5um |
|
|
| SBU Configuration |
|
Yes |
|
|
| Stack via |
|
Yes |
|
|
| Skip via |
|
Yes |
|
|
| Surface Finishing |
ENIG, OSP,ENIG+OSP |
|
Immersion Silver / Tin |
|
Electrolytic Gold，Gold Finger, ENEPIG |
| Material |
Normal Tg |
Tg=135, 150 |
| High Tg |
Tg=170, 180, 210 |
| Halogen Free |
YES |
| Advanced |
Buried Resistor |
Sample+ Accredit |
| |
|
|
|
|
